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TPS856
TOSHIBA Photo-IC Silicon Epitaxial Planar
TPS856
Mobile Phones Notebook PCs, PDAs Video cameras, Digital Still Cameras Other Equipment Requiring Luminosity Adjustment
The TPS856 is an ultra-compact surface-mount photo-IC for illuminance sensors which incorporates a photodiode and current amp circuit in a single chip. The sensitivity is superior to that of a phototransistor, and exhibits little variation. It has spectral sensitivity closer to luminous efficiency and excellent output linearity. TOSHIBA With its ultra-compact surface-mount package, this photo-IC can be Weight: 0.003 g (typ.) used as the power-saving control for domestic appliances or for backlighting for displays in cellular phones, this device enables low power consumption to be achieved. This device includes stand-by function which can reduce the power consumption. * * * Ultra-compact and light surface-mount package: 1.6 x 1.6 x 0.55 mm Excellent output linearity of illuminance Little fluctuation in light current and high level of sensitivity : IL = 57 A (typ.) @EV = 100 lx using fluorescent light : Light current variation width: x 1.67 ( When light current classification is specified.) : Little temperature fluctuation Built-in luminous-efficiency correction function, reduced sensitivity variations due to various light sources : IL (using incandescent light)/IL (using fluorescent light) = 1.0 (typ.) Low supply voltage, making device suitable for battery-powered equipment: VCC = 1.8 V to 5.5 V Lead(Pb)-Free
* * *
Absolute Maximum Ratings (Ta = 25C)
Characteristics Supply voltage Stand-by voltage Output voltage Light current Permissible power dissipation Power dissipation derating (Ta > 25C) Operating temperature range Storage temperature range Soldering temperature range (Note 1) Symbol VCC Vstb VOUT IL P P/C Topr Tstg Tsol Rating -0.5 to 6 < VCC = Unit V V V mA mW mW/C C C C
< Vstb =
5 30 -0.4 -30 to 85 -40 to 100 260
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: The reflow time and the recommended temperature profile are shown in the section entitled Handling Precautions.
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Operating Ranges
Characteristics Supply voltage Stand-by on voltage Stand-by off voltage Symbol VCC Vstbon Vstboff Min 1.8 1.8 0 Typ. Max 5.5 VCC 0.3 Unit V V V
Electrical and Optical Characteristics (Ta = 25C)
Characteristics Supply voltage Supply current (1) Supply current (2) Light current (1) Symbol VCC ICC(1) ICC(2) IL (1) Test Condition VCC = 3 V, Vstb = 3 V,EV = 1000 lx (Note 2) (Note 5) RL = 1 k VCC = 3 V, Vstb = 0.3 V,EV = 1000 lx (Note 2) (Note 5) RL = 1 k VCC = 3 V, Vstb = 3 V,EV = 100 lx (Note 2), (Note 4) VCC = 3 V, Vstb = 3 V,EV = 10 lx (Note 3), (Note 4) VCC = 3 V, Vstb = 3 V,EV = 100 lx (Note 3), (Note 4) VCC = 3 V, Vstb = 0.3 V,EV = 100 lx (Note 3), (Note 4) Min 1.8 Typ. 3.0 3.0 57 Max 5.5 Unit V A A A
Light current (2)
IL (2)
4.0
5.7
8.0
A
Light current (3)
IL (3)
40
57
80
A
Light current (4)
IL (4)
0.02
0.1
A
Light current ratio
IL (1) IL (3) ILEAK VO twait Rise time tr tf td ts

1.0
A
Dark current Saturation output voltage Waiting time
VCC = 3 V, Vstb = 3 V,EV = 0 VCC = 3 V, Vstb = 3 V,RL = 150 k, EV = 100 lx (Note 3) VCC = 3 V, Vstb = 3 V,RL = 150 k, EV = 5 lx (Note 3)
0.1 0.85 20

0.70
V ms
70 40 100 5
Switching time
Fall time Delay time Storage time
VCC = 3 V, Vstb = 3 V,RL = 5 k (Note 7)

s
Note 2: CIE standard A light source is used (color temperature = 2856K, approximated incandescence light). Note 3: F10 of fluorescence light is used as light source. (color temperature = 5000K) However, white LED is substituted in a mass-production process. IL(3) classification A rank: 44.1 A to 73.7 A Note 4: Light current measurement circuit
Light source VCC IL TPS856 OUT A Vstb
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Note 5: Supply current measurement circuit
ICC A Light source RL Vstb OUT VCC
TPS856
Note 6: Waiting time measurement method
Vstb VCC
Light source
0V Vstb
TPS856
RL Vstb
VOUT VOUT twait
10%
Note 7: Switching time measurement method
IF Pulse drive White LED TPS856 RL Vstb VOUT Vstb 90% VCC IF
VOUT td
10% tf ts tr
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Package Dimensions
0.20
3
2
1
Unit: mm Tolerance: 0.1 ( ): Reference value
1.20
0.20 0.3Typ.
4
5
6
0.20
0.50 1.60
0.50
5
1.60
5
0.10
0.55
5
max0.2
Weight: 0.003 g (typ.)
Block Diagram
max0.2
Pin connection 1. VCC 2. GND 3. GND 4. GND 5. GND 6. OUT (Vstb)
(0.8)
Equivalent circuit in output part
Vcc PD
0.10
VCC OUT
PD with filter
OUT
GND
GND
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Handling Precautions
Insert a bypass condenser of up to 0.1F between VCC and GND near the device to stabilize the power supply line. Please put the bypass capacitor of 0.1uF between OUT and GND near the device if you use it as a current output (There is no load resistance). When VCC is turned on it takes at least 20 ms for the internal circuit to stabilize. During this time the output signal is unstable. Please do not use the unstable signal as the output signal.
Moisture-Proof Packing
(1) (2) To avoid moisture absorption by the resin, the product is packed in an aluminum envelope with silica gel. Since the optical characteristics of the device can be affected during soldering by vaporization resulting from prior absorption of moisture and they should therefore be stored under the following conditions: Temperature: 5C to 30C, Relative humidity: 70% (max), Time: 168 h (max) Baking in taping with reel is required if the devices have been store unopened for more than six months or if the aluminum envelope has been opened for more than 168 h. These devices are packed on tapes; hence, please avoid baking at high temperature. Recommended baking conditions: 60C for 12 h or longer, Perform baking only once
(3)
Mounting Precautions
TPS856 uses a clear resin, and delicate handling is necessary for it. The characteristic change or the product might be damaged by the handling method of mounting. Please note the following and handle the product. (1) Do not apply stress to the resin at high temperature. Time until the product returns at the normal temperature after mounting of the reflow is different according to the mounting substrate and the environment. Please do not give the stress with heat remained in the product. (2) The resin part is easily scratched, so avoid friction with hard materials. (3) When installing the assembly board in equipment, ensure that this product does not come into contact with other components. (4) Please confirm the heat contraction of the substrate of the reflow mounting doesn't influence the product. The load is given to the product by mounting that the heat contraction is large on the substrate and the installation position of the substrate. Please note that the characteristic changes or the product might be damaged.
Mounting Methods
(1) Example of reflow soldering
10s max (*)
Temperature (C)
4C/s max (*)
260C max (*) 230C
190C 180C 4C/s max (*) Preheating part 60120 s
30 s to 50 s Heating part
Time (s)
(*)The product is evaluated using above reflow soldering conditions. No additional test is performed exceed the condition (i.e. the condition more than MAX values) as an evaluation. Please perform reflow soldering under the above conditions. Perform reflow soldering no more than twice. * Please perform the first reflow soldering within 168 h after opening the package with reference to the above temperature profile.
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* Second reflow soldering In case of second reflow soldering, it should be performed within 168 h after first reflow under the above conditions. Storage conditions before second reflow soldering: 30C, 70% RH or lower * * Do not perform flow soldering. Make any necessary soldering correction manually. (Do not do this more than once for any given pin.) Temperature: no more than 350C (25 W for soldering iron) Time: within 5 s (2) Recommended soldering pattern
Unit: mm 0.3
0.45
1.0
1.35
0.5
0.5
(3)
Cleaning conditions When cleaning is required after soldering Chemicals: AK225 alcohol Temperature and time: 50C x 30 s or 30C x 3 min Ultrasonic cleaning: 300 W or less
Packing Specification
(1) Packing quantity
Reel (minimum packing quantity) Carton 3,000 devices 5 reels (15,000 devices)
(2)
Packing format Silica gel and reel are packed into sealed aluminum envelope. Pack shock-absorbent materials around the aluminum envelopes in the cartons to cushion them. * Carton specification
Label
Carton dimensions (W) 81 mm x (L) 280 mm x (H) 280 mm
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Tape Packing Specifications
(1) Reel dimensions Reel material: Plastic
11.41.0 9.00.3 5.0
Unit: mm
+1.0 60 -0
5.0
+0 180 -1.0
Enlarged view of reel center
21 0.8
2 0.5
120
13 0.2
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(2) Tape dimensions Tape material: Plastic (anti-electrostatic)
Unit: mm 4.00.1
1.5 -0
+0.1
2.00.05
B'
1.750.1
0.25 0.05 B'
3.50.1
8.00.2
1.8 0.1 max 6
A
1.10.1
A'
(2.75)
max 6
B
0.85 0.1
4.00.1 1.7 0.1
B
max 6 A A'
max 6
Product direction
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Reel Label
The label markings may include product number, quantity and seal date.
P/N TYPE ADDC NOTE TPS856 Q'TY 3,000 pcs. Sensor hole
Position of label
Leader and Trailer Sections of Tape
Note 1 : The leader portion shell consist of cover tape minimum length of 300 mm and a piece of carrier tape with empty portion of 100 mm minimum. Note 2 : The trailer portion shall consist of empty carrier of more than 10 cavities.
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P - Ta
40 35 1 VCC = 3 V Vstb = 3 V 0.1
ILEAK - Ta
(typ.)
P (mW)
30 25 20 15 10 5 0 0
Power dissipation
ILEAK
0.01
Dark current
(A)
0.001
20
40
60
80
100
0.0001 20
40
60
80
100
Ambient temperature
Ta
(C)
Ambient temperature
Ta
(C)
IL - EV
10000
(typ.)
10000
IL - EV
(typ.)
1000
1000
(A)
IL
Light current
10
Light current
Ta = 25C VCC = 3 V Vstb = 3 V A light source Fluorescent light 10 100 1000 10000
IL
100
(nA)
100 10
1
1
Ta = 25C VCC = 3 V Vstb = 0.3 V A light source Fluorescent light 10 100 1000 10000
0.1 1
0.1 1
Luminance
EV (lx)
Luminance
EV (lx)
Relative IL - VCC
1.2
(typ.)
1.2
Relative IL - Vstb
(typ.)
Relative light current
1.0
Relative light current
Ta = 25C VCC = Vstb
1.1
1.1
1.0
0.9
0.9 Ta = 25C VCC = 5.5V
0.8 1
2
3
4
5
6
0.8 1
2
3
4
5
6
Supply voltage
VCC
(V)
Standby Voltage
Vstb (V)
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ICC - EV
100
(typ.)
100
ICC - EV
(typ.)
(A)
ICC
ICC
1
(A) Consumption current
10
10
1
Consumption current
0.1
0.1
0.01
Ta = 25C VCC = 3 V Vstb = 3 V A light source Fluorescent light 10 100 1000 10000
0.01
Ta = 25C VCC = 3 V Vstb = 0.3 V A light source Fluorescent light 10 100 1000 10000
0.001 1
0.001 1
Luminance
EV (lx)
Luminance
EV (lx)
Spectral Response
100 Ta = 25C
(typ.) Radiation pattern (typ.) Ta = 25C
80
Relative sensitivity
60
Luminosity angle 30
40 50
20
10
0
10
20 30 40 50 60 70 80 90 1.0
40
60 70
20
80 90
0 200
0
0.2
0.4
0.6
0.8
400
600
800
1000
1200
Wavelength
(nm)
Relative IL - Ta
1.40 Vcc = 3 V Vstb =3 V Using fluorescent light 100 lx
(typ.)
VO - Ev
4.0 Ta = 25C VCC = 3 V Vstb = 3 V 3.0
(typ.)
Relative light current
1.20
Output voltage Vo(V)
1.00
2.0
Fluorescent light RL=1 k Fluorescent light RL=5.1 k Fluorescent light RL=30 k A light source RL = 1 k A light source RL = 5.1 k A light source RL = 30 k
0.80
1.0
0.60 -40
-20
0
20
40
60
80
100
0 0
1000
2000
3000
4000
5000
6000
7000
Ambient temperature
Ta
(C)
Luminance
Ev (lx)
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Switching Characteristics (Non-saturating operation)
Ta = 25C VCC = Vstb = 3 V VOUT = 1.5 V Using white LED
10000
(typ.)
10000
Switching Characteristics (Saturating operation)
Ta = 25C VCC = Vstb = 3 V VOUT .< 1.0 V Using white LED
(typ.)
1000
1000
(s)
Switching time
100
Switching time
td tr tf
(s)
100 10 10 td tf tr 1 ts ts 1 1 0.1 1 10 100 1 0.1
1
Load resistance
RL
(k)
10
100
Load resistance
RL
(k)
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RESTRICTIONS ON PRODUCT USE
* The information contained herein is subject to change without notice.
20070701-EN GENERAL
* TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer's own risk. * The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. * Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations.
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